Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5492057
Kind Code:
A
Abstract:
PURPOSE:To secure a simple connection between the chip electrode and the lead by forming the spherical protrusion by heating the tip of the each electrode draw- out lead forming the lead frame and then pressure-bonding the protrusion on the electrode of the semiconductor chip. CONSTITUTION:Torch electrode 4 for heating and fusing is provided at the tip part of lead 2 which is formed in a body with lead frame 1. Then the voltage is applied between frame 1 and electrode 4 to produce discharge, and thus spherical protrusion 5 is formed at the tip of lead 2. In this way, protrusion 5 is formed in sequence at all tips of plural units of lead 2 and then positioned to each electrode 7 of semiconductor chip 8. After this, the pressure ponding or sealing is given via heating compressor 6. In such way, no different metal is required for the protrusion metal, thus simplfying the connection as well as reducing the cost.
Inventors:
HARAGUCHI TAKASHI
Application Number:
JP16070477A
Publication Date:
July 20, 1979
Filing Date:
December 28, 1977
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L21/603; H01L21/60; (IPC1-7): H01L21/60
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