Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS57112039
Kind Code:
A
Abstract:
PURPOSE:To correct the position of a semiconductor chip surface relative to a chip mounting substrate and thereby prevent a short circuit by a method wherein an electrode of a semiconductor chip surface and an electrode of a chip mounting substrate is provided with a bumper ball that is caused to melt by heat and then merges with the other when two electrodes facing with each other are connected. CONSTITUTION:Each of the bonding pads 3 of an IC chip 2 is provided with a bumper ball 4 and each of the bonding pads 6 connected to the leads 12 of a package 5 that is to mout the chip 2 is also provided with a bumper ball 11 confronting the bumper ball 4. Next, the ball 4 is made to face downward to abut against the ball 11 opposing it. The ball 4 and ball 11 are then subjected to high temperatures, melting and merging with each other, when a surface tension F is generated on the surface of the combination. The force is inclined to transform the liquefied balls into a sphere, which in turn causes the light weight chip 2 to travel a very short distance in line with the transformation of the merged balls into a sphere, automatically providing the chip with a corrected position ensuring excellent electric junction.
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Inventors:
SUZUKI HIROICHI
Application Number:
JP18784780A
Publication Date:
July 12, 1982
Filing Date:
December 29, 1980
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H05K3/34; H01L21/60; (IPC1-7): H05K3/34
Domestic Patent References:
| JPS5050866A | 1975-05-07 | |||
| JPS544979A |