Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS6066440
Kind Code:
A
Abstract:
PURPOSE:To realize the reduction of cost on bonding with the substrate of a semiconductor element by a die, and to improve yield by previously forming an adhesive layer under a half-fused state by preparatorily heating the substrate and providing a process in which the semiconductor element is brought into contact with the adhesive layer, heated, bonded and fixed in a treatment process. CONSTITUTION:Paste is applied previously to a tab 3 through stamping treatment or screen printing treatment, and heated preparatorily to decomposed and evaporate a solvent while metallic particles are mutually sintered partically, thus forming a conductor layer 10. Such a conductor layer 10 is formed previously to the tab 3, the tab 3 section in a frame 1 is heated on bonding by a die, a cut chip l2 is held to a secribing jig in the same manner as the jig has been used for manufacturing an AU.Si eutectic, and the chip is rubbed against the conductor layer 10 formed to the tab 3, thus bonding the chip with the tab by the die.
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Inventors:
MIZUO NOBUHIKO
Application Number:
JP17456683A
Publication Date:
April 16, 1985
Filing Date:
September 21, 1983
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L21/52; H01L21/58; (IPC1-7): H01L21/58
Attorney, Agent or Firm:
Sadaichi Igita