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Patent Searching and Data


Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS62144348
Kind Code:
A
Abstract:

PURPOSE: To conduct sealing completely by making a nose section thinner than the root higher than the depth of a spot facing section for a package section in a projecting section formed to a cover section, melting and deforming a section in the vicinity of at least the nose and fast sticking the nose section to the spot facing section.

CONSTITUTION: A plastic-type-package section 20 with an external leading-out lead, a hollow section, to which one end of the lead is exposed and on which a semiconductor chip can be loaded, and a spot facing section 11 shaped so that the hollow section is surrounded by a package-sealing section on the outside of the hollow section, and a cover section 34 with a projecting section 12, a shape thereof is made different from the section of the spot facing section 11 for the package section 20 and thickness is made thinner than a nose thereof and which has height more than the height of said spot facing section 11, and shaped by a thermoplastic resin are prepared. The spot facing section 11 for said package 20 and the projecting section 12 in said cover section 34 are fitted, a section in the vicinity of at least the nose of said projecting section 12 is melted and deformed, and the projecting section 12 is fast stuck to said spot facing section 11, thus hermetically sealing the stuck to said spot facing section 11, thus hermetically sealing the hollow section in the package section 20. It is proper that said projecting section 12 is melted and deformed with pressing, applying heat and ultrasonic waves.


Inventors:
Okuaki, Yutaka
Asami, Yukio
Application Number:
JP1985000284275
Publication Date:
June 27, 1987
Filing Date:
December 19, 1985
Export Citation:
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Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
H01L23/50; B29C65/00; H01L21/50; (IPC1-7): H01L23/48