PURPOSE: To shorten a manufacturing time and to reduce conveyance troubles in a wire-bonding process, by conducting wirebonding of a lead frame put in the state of high temperature while keeping the same in the state of high temperature.

CONSTITUTION: A semiconductor pellet 2 is mounted on the upper surface of a lead frame 1 with epoxy resin interposed between them, and die-bonding is conducted. After the completion of die-bonding, exposure to an atmosphere of high temperature about 250oC is made so as to fix and stabilize the epoxy resin as an adhesive, and thereafter wire-bonding is conducted with this state of high temperature maintained. This process is performed, for instance, by a method wherein the lead frame 1 whereon the semiconductor pellet 2 is mounted is put on the upper surface of a heating device 3 provided in a frame supplying element and is supplied for wire-bonding. This method enables the shortening of a manufacturing time and the reduction of conveyance troubles in a wire-bonding process.