Title:
MANUFACTURE OF SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JPS63199610
Kind Code:
A
Abstract:
In a process for manufacturing semiconductor components, in particular for fairly high powers, at least one circular component substrate (2) of fairly small area is cut out of a wafer (1) with a hollow drill (4). According to a preferred design, a hollow drill (4) having an inclined inside leading edge (8) is used so that the edge chamfering necessary for certain components having fairly high reverse voltage is produced at the same time as the component is drilled out.
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Inventors:
IIRII DOROOHII
OTSUTOO KUUN
OTSUTOO KUUN
Application Number:
JP2484488A
Publication Date:
August 18, 1988
Filing Date:
February 04, 1988
Export Citation:
Assignee:
BBC BROWN BOVERI & CIE
International Classes:
B23D59/02; B24B9/06; B28D1/04; B28D5/00; B28D5/02; H01L21/304; (IPC1-7): B28D5/00; H01L21/304
Attorney, Agent or Firm:
Minoru Nakamura (4 outside)
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