PURPOSE: To coat the irregularities of the surface of a semiconductor substrate completely with a photosensitive resin uniformly without the loss of a material, and to apply the photosensitive resin precisely in arbitrary thickness by dipping the semiconductor substrate, on the surface of which a conductive film is formed, into the water-soluble photosensitive resin received in an electrolytic bath for electrodeposition coating and precipitating a photosensitive film through DC electrolysis.
CONSTITUTION: When a photosensitive resist film is shaped onto the surface of a semiconductor substrate 3, a conductive film 15 is formed onto the surface of the semiconductor substrate 3, the semiconductor substrate 3 is dipped into an electrodeposition-coating water-soluble photosensitive resin 12 housed in an electrodeposition coating tank 11, and a photosensitive resist film is deposited through DC electrolysis. The semiconductor substrate 3, on the surface of which to be coated with a resin the conductive layer 15 such as a metallic layer in Al, Cu, etc., an ITO layer, etc. are shaped previously, is immersed into the electrodeposition- coating water-soluble photosensitive resin 12. DC voltage of approximately 200V is applied between the conductive layer 15 on the surface of the semiconductor substrate 3 and a cathode 13, thus electrodepositing the photosensitive resin dissolved or dispersed into the liquid 12 and charged at positive charges onto the surface of the conductive layer 15 on the surface of the semiconductor substrate 3.
ITOU KIYOYUKI
KOBAYASHI ISAO
HOSHINO MASAHIRO
| JPS60207139A | 1985-10-18 |