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Title:
MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Document Type and Number:
Japanese Patent JPH04321213
Kind Code:
A
Abstract:

PURPOSE: To focus a focal point on first and second regions and to reduce a short-circuit between wirings due to out of focus by exposing photoresist films of the regions in separate steps.

CONSTITUTION: An entire main surface of a semiconductor substrate is coated with a photoresist film 9. However, steps corresponding to a base shape are formed on the surface of the film 9. Then, the film 9 is exposed by using a mask formed with a wiring pattern only on a memory cell array, and developed. Thereafter, with the film 9 as an etching mask a conductive film is patterned, and wirings 8 of the array are formed. Then, a photoresist film 10 is formed on the entire main surface of a semiconductor substrate. Thereafter, a focal point is focused on a peripheral circuit by using the mask formed with the wiring pattern of the peripheral circuit, the film 10 is exposed and developed. Thus, its yield can be improved.


Inventors:
UCHIYAMA HIROYUKI
SUWAUCHI NAOKATSU
MIYAZAWA HIROYUKI
Application Number:
JP9043991A
Publication Date:
November 11, 1992
Filing Date:
April 22, 1991
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
H01L21/3205; H01L21/027; H01L23/52; (IPC1-7): H01L21/027; H01L21/3205
Attorney, Agent or Firm:
Akita Haruki



 
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