Title:
MANUFACTURE OF SEMICONDUCTOR LIGHT EMITTING DEVICE
Document Type and Number:
Japanese Patent JPS5723283
Kind Code:
A
Abstract:
PURPOSE:To obtain an accurate alignment between an element and a lens, by a method wherein a thermosetting bonding agent is applied on the lower surface of the spherical lens while it is being held by a vacuum tweezer, the lens is contacted with the upper face of the semiconductor light-emitting element placed on a stem heated at a suitable temperature, and it is bonded while a microscope is being used to observe them. CONSTITUTION:A surface illuminating type light-emitting diode 1 is mounted on a mounting stem 3, the diode 1 is heated by a heater 4 to the temperature cooresponding to the bonding agent used. A spherical lens 2 is sucked and held by a vacuum tweezer 10 and moved to a container of the bonding agent to apply a transparent thermosetting bonding agent 15 of a silicon resin on the lower surface of the lens 2. Then, the position of the lens 2 is adjusted by using of a microscope 14 so that the lens 2 contacts with the diode 1. After the bonding agent 15 is hardened, the lens 2 and the diode 1 are fixed. Then, said light-emitting element is removed as a unit from the stem 3 and transferred to the subsequent process to complet a semiconductor light-emitting element.
Inventors:
FURUYAMA HIDETO
UEMATSU YUTAKA
UEMATSU YUTAKA
Application Number:
JP9722180A
Publication Date:
February 06, 1982
Filing Date:
July 16, 1980
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
G02B6/42; H01L33/58; H01L33/62; H01S5/00; (IPC1-7): H01L33/00; H01S3/18