Title:
MANUFACTURE OF SEMICONDUCTOR PACKAGE
Document Type and Number:
Japanese Patent JPH1167964
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor package, which hardly reduces the bonding strength of the part between a conductor circuit and an applied resin composition in the case, where the package is subjected to moisture absorption treatment and at the same time, can obtain the semiconductor package, whose insulation characteristic is hardly deteriorated. SOLUTION: A thermosetting resin composition is applied on a prescribed position on the surface of a substrate 11b with a conductor circuit 12b, formed on the surface thereof and thereafter, a resin layer is cured. Then a sheetlike bonding agent 15 is made to interpose between the substrate 11b and a substrate 11a and while a recessed semiconductor element arrangement part 17, through which the circuit 12b is exposed, is formed, the substrate 11a is laminated on the substrate 11b and is adhered to the substrate 11b. In this case, after the epoxy resin composition containing a cresol novolak resin as a curing agent is applied on the prescribed position on the surface of the substrate 11b with the circuit 12b formed on the surface thereof, the resin layer 22 is cured. Then, after a cresol novolak resin composition containing an aromatic amine curing agent is applied on the surface of the cured resin layer 22, a resin layer is cured, and then, the bonding agent 15 is made to interpose between the substrates 11b and 11a, and the substrate 11a is laminated on the substrate 11b.
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Inventors:
MAKITA TOSHIYUKI
SATO KOJI
SATO KOJI
Application Number:
JP22961697A
Publication Date:
March 09, 1999
Filing Date:
August 26, 1997
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08L63/02; C08G59/62; H01L23/12; H05K1/00; H05K3/46; (IPC1-7): H01L23/12; C08L63/02
Attorney, Agent or Firm:
Shigeji Sato (1 person outside)