Title:
MANUFACTURE OF SEMICONDUCTOR PRESSURE SENSOR
Document Type and Number:
Japanese Patent JPH04370727
Kind Code:
A
Abstract:
PURPOSE:To manufacture a seal diaphragm type semiconductor pressure sensor which can attain high reliability, so that it is small in size and inexpensive. CONSTITUTION:A recessed part for holding a pedestal 22, a pressure-sensitive chip 23 and a lead wire 24 is formed on the upper surface side of a metal base 21, and a pressure-receiving diaphragm 26 receiving a measuring pressure directly is provided so that it covers the recessed part. Oil 27 as a pressure medium for transmitting the pressure received by this pressure-receiving diaphragm 26 to the pressure-sensitive chip 23 is filled up in a chamber formed by the pressure-sensitive diaphragm 26, the metal base 21, the pedestal 22 and the pressure-sensitive chip 23. The metal base 21 is molded in a required shape by a metal injection molding method. The metal injection molding method uses a mold for molding, and the fine powder of a metal wherein a resin binder is mixed is molded by injection and further sintered to be molded.
Inventors:
ITO TATSUYA
Application Number:
JP17431691A
Publication Date:
December 24, 1992
Filing Date:
June 19, 1991
Export Citation:
Assignee:
FUJIKURA LTD
International Classes:
G01L9/04; G01L9/00; H01L29/84; (IPC1-7): G01L9/04; H01L29/84
Attorney, Agent or Firm:
Itami Masaru