PURPOSE: To eliminate an unbonded part, at the outer circumference of wafers, caused at a pasting operation and to prevent the breakage produced at the outer circumference part of the wafers by a method wherein two wafers are pasted and, after that, their outer circumference is chamfered.
CONSTITUTION: Two wafers 1 and 2 are pasted; after that, the outer circumference part of the two wafers 1 and 2 which have been pasted in advance is chamfered. As a result, when the wafer 1 on one side is polished and processed at a posterior process, the peripheral end edge 1a of the wafer 1 on one side is not levitated from the wafer 11 on the other side. That is to say, since an unbouded part is eliminated, a breakage is not produced at the outer circumference part of the wafer 1 on one side. Consequently, reliability of a semiconductor substrate 1d is increased, and the yield of a device formed on the substrate 16 can be increased.
SATO HIROSHI
SHIMANOE MUNEHARU
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