Title:
MANUFACTURE OF SEMICONDUCTOR
Document Type and Number:
Japanese Patent JPH05243142
Kind Code:
A
Abstract:
PURPOSE: To make it possible to improve the durability of a structural material as well as to make it possible to suppress a power consumption at the time of heating treatment of a wafer to the minimum.
CONSTITUTION: A heating plate 10 of a temperature near a treatment temperature of a wafer 7 among a plurality of pieces of heating plates 10 is selected on the basis of the detected temperatures from a temperature sensor 12 for detecting the respective temperatures of the heating plates 10. After this, the selected heating plate 10 is controlled via a CPU 14, its temperature is set at the treatment temperature and the wafer 7 is arranged on this plate 10 and is subjected to heating treatment.
Inventors:
SATO ISAO
OTSUKA HIROSHI
OTSUKA HIROSHI
Application Number:
JP7624792A
Publication Date:
September 21, 1993
Filing Date:
February 27, 1992
Export Citation:
Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
H01L21/027; (IPC1-7): H01L21/027
Attorney, Agent or Firm:
Funabashi Kuninori