PURPOSE: To reduce warpage and torsion when a structure for a laminated board is subjected to a working process of a printed circuit board by forming the structure for the laminated board of two pairs of prepreg layers, each with a metallic foil on one side so that metallic foils are positioned on both surfaces through a release film sandwiched between the two layers.
CONSTITUTION: When a structure for a laminated board is held between mirror boards 5 and heated and pressure-molded, the state in which two single-sided metallic foil-clad laminated boards 4 are integrated through a release film 1 can be acquired. The release film 1 is not bonded with the laminated boards 4 at that time. Since fine irregularities are shaped to the surface of the release film 1 through roughening, however, a softened fluidized resin is draped with the irregularities when the laminated boards 4 are molded, and the laminated boards 4 and the release film 1 are integrated firmly by the so-called anchoring effect. Accordingly, when the structure is employed for a forming process for a printed circuit under the state, the generation of warpage and torsion can be inhibited.
NODA MASAYUKI
KARIYA KENICHI
TAKAHASHI KATSUHARU
| JPS5434142A | 1979-03-13 | |||
| JPS5857949A | 1983-04-06 |
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