PURPOSE: To obtain the titled smoothly planed board which an exposing portion of specified adhesives is difficult to be flawed by a method wherein the back of metallic foil is coated with the adhesives, the foil is stacked on thermohardening resin prepreg and unified by means of a heating press, and the excessive surface of the metallic foil is removed by means of etching as the desired pattern is left as it is.

CONSTITUTION: Adhesives are prepared by compounding about 20W80wt. portion butylized melamine resin or (and) polyfunctional epoxy resin, preferably, epoxy resin, which has a trifunctional property and whose color does not change, to 100wt. portion vinyl butylal resin having high molecular cyclic acetal structure obtained by a reaction between polyvinyl alcohol and butyl aldehyde. The adhesives are applied on the back of metallic foil at the rate of about 15W40g/m2 in conversion as solid matter, the foil is stacked on thermohardening resin prepreg in a shape that a surface coated with the adhesives is faced to the prepreg side, and unified by means of a heating press, and the excessive surface of the metallic foil is removed by means of etching as the desired pattern is left as it is, thus obtaining a smoothly planed board as an object.