Title:
MANUFACTURE OF SOLDERING PAD PART FOR PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPH0677635
Kind Code:
A
Abstract:
PURPOSE: To achieve cost reduction by allowing formation of soldering pad part for printed circuit board through a convenient and inexpensive method requiring no cream solder or screen printer for applying cream solder.
CONSTITUTION: Soldering pad parts are provided for a printed circuit board by coating a printed circuit board 1 with solder resist 5 except the pad parts 3, applying flux 6 on the pad parts 3, delivering solder balls 7 through the tip 15a of a nozzle 15 and placing several solder balls 7 on the flux 6 by means of a solder ball feeder 10.
Inventors:
ARAI MINORU
Application Number:
JP22705992A
Publication Date:
March 18, 1994
Filing Date:
August 26, 1992
Export Citation:
Assignee:
ACE DENSHI KOGYO KK
International Classes:
H05K3/24; H05K3/34; (IPC1-7): H05K3/34; H05K3/24
Attorney, Agent or Firm:
Dozo Isono
Next Patent: SURFACE MOUNTING METHOD FOR SEMICONDUCTOR COMPONENT