PURPOSE: To reduce malfunctions due to the adherence of dusts and to facilitate the management of a manufacturing line by forming a bump on the electrode pad of a solid-state image sensing element, and connecting it through a wiring layer formed on an optical glass to a circuit substrate.

CONSTITUTION: An aluminum or aluminum bump 23 is formed through a nail head bonding on the electrode pad 22 of a solidstate image sensing element 21. After the electrode wirings 25 of an optical glass 24 formed with electric wirings and the bump 23 formed on the pad of the element are then positioned, they are connected under pressure. When the glass 24 is pressurized, the part formed with the bump 23 is locally heated to easily bond the bump 23 on the electrode pad of the element to the electrode wirings of the glass. Then or simultaneously, electrode wirings 26 of the glass are electrically connected under pressure to a wiring layer 28 made of copper on a circuit substrate 37.