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Title:
MANUFACTURE OF THICK BOTTOM CASE IN TEMPERATURE FUSE
Document Type and Number:
Japanese Patent JP03152817
Kind Code:
A
Abstract:

PURPOSE: To stabilize the performance of a product by forming a guide hole in a material formed by cutting a wire material by use of a die and a punch, forming a hollow hole by a die and a sleeve, and forming a through hole on the bottom of the hollow hole by a pin.

CONSTITUTION: A wire material is cut into a determined size by a multiple-stage pressing machine. A cut material 13 is pressed by a first die 14 and a first punch 15 to form a blank 18 having flat front cut surface and rear end surface. The blank 18 is pushed into a second die 16 by a second punch 17 to form a guide hole 18 in its front end surface. The blank 18 is pushed into a third die 19 by a first sleeve 20, and also a recessed hole 22 having a diameter slightly larger than that of a hollow hole 21 is pressed by a first pin 23 and formed on the front end surface of the blank 18. The resulting blank 18 is pushed into a forth die 24 by a second sleeve 25, and also the hollow hole 21 in which the bottom part is thicker than the cylinder part is formed by a second pin 26. The blank 18 is pushed into a fifth die 25 by a third sleeve 28, and also a through hole 30 is formed on the bottom surface of the blank 18 by a pin 29, whereby a case 1 is obtained.


Inventors:
Onishi, Mitsuo
Naito, Toshio
Application Number:
JP1989000290777
Publication Date:
June 28, 1991
Filing Date:
November 07, 1989
Export Citation:
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Assignee:
NITTO SEIKO CO LTD
International Classes:
H01H37/76; H01H37/04; H01H37/32; H01H37/00; (IPC1-7): H01H37/04; H01H37/32; H01H37/76