PURPOSE: To prevent residues of a thin film circuit pattern from remaining at the area near the stepped portion by forming a carbon film, then flattening the stepped portion and thereafter coating the surface with the resist including silicon.
CONSTITUTION: A narrowed portion is generated at the area lower than the stepped portion when a conductive film 2 and a carbon film 3 are given to a substrate 1 having the projected and recessed area or stepped portion due to the other thin film pattern, etc. The surface of carbon film 3 is spin-coated with a liquidified organic film 4, the stepped portion of substrate 1 is smoothed and the such smoothed area is spin-coated with the photoresist 5 including silicon. Difference between film thickness of photoresist 5 at the upper and lower portions of the stepped portion is set to a comparatively small value and existence of residues of pattern at the lower part of stepped portion can be prevented after exposure and development of the photoresist 5.
IKEDA HIROSHI
HOSODA SHOZO
SUZUKI SABURO
MORIJIRI MAKOTO
HAYASHI MASAYUKI
