PURPOSE: To apply a thin film multilayer circuit board to independent wiring and enable high-density wiring too, and prevent the breaking of wire passing above a via or layer thinning, concerning the manufacture of a thin film multilayer circuit board where a multilayer wiring layer such as a power source wire, a signal line, a pad, etc., are formed, and which includes the process of forming a stacked via required for materializing high-density wiring.

CONSTITUTION: This manufacture includes a process of forming an insulating film 3 covering first wiring 2, a process of forming a first via hole 6 in the first insulating film 3 and filling up a plated layer 6 inside a first via hole 6 by electroless plating, a process of forming a flattening insulating layer 8 on the plated layer 7 and the insulating layer 3, and a process of forming a second via hole 9 on the flattening insulating layer 8 right above the plated layer 7. Thin film multilayer wiring is constituted, including a process of forming second wiring 10 connecting with the plated layer 7 exposed from the second via hole 9 on the flattening insulating layer 8 or repeating from the process of forming the insulating film 3 to the process of forming the second wiring 10.