MANUFACTURE OF THIN FILM MULTILAYERED BOARD

Title:

MANUFACTURE OF THIN FILM MULTILAYERED BOARD

Document Type and Number:

Japanese Patent JPH04246889

Kind Code:

A

Abstract:

PURPOSE: To enable a thin film multilayered board to be manufactured with a high yield.

CONSTITUTION: Intermediate layer member manufacturing processes 31 and 32 are carried out independently of lamination and other processes 35-38, non- defective intermediate layer members are used in the lamination process 35, and the defective wiring layer pattern of a thin film layer board is hardly generated in a manufacturing process. Defective products are hardly generated in a carrier removing process 36, an adhesive layer via forming process 37, and a connection pattern forming process 38.

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Inventors:

TOMIZAWA SHIGERU
NAKANO KAZUO
KOBAYASHI HIROMITSU
TAKAHASHI YASUHITO
MISAWA MIKA
YAMAMOTO YUKIO
FUJIKAWA MAKOTO

Application Number:

JP1222591A

Publication Date:

September 02, 1992

Filing Date:

February 01, 1991

Export Citation:

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Assignee:

FUJITSU LTD

International Classes:

H05K3/46; (IPC1-7): H05K3/46

Attorney, Agent or Firm:

Tadahiko Ito (2 outside)

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