PURPOSE: To provide a method for manufacturing a thin-film resistor wherein only the Al layer can be selectively etched by etching the Al layer, wiring material, using an alkaline aqueous solution, an attachment-repellent plate for a film deposition equipment which has such a structure that there is no decline in an yield due to particles even if the cleaning frequency of a film deposition chamber is decreased, and a film deposition equipment which is provided with the attachment-repellent plate.
CONSTITUTION: When a wiring electrode which is mainly formed of Al is etched with an alkaline aqueous solution, only the Al layer is selectively etched without etching a resistor layer. Therefore, the fluctuation in a resistance value of a resistor is decreased and thereby an yield and the productivity are increased and eventually the reliability of the thin-film resistor is enhanced. And, by installing an attachment-repellent plate of a specific structure in a film deposition chamber of a specific film deposition equipment for manufacturing the thin-film resistor, a film deposit which is deposited on the attachment-repellent plate can be discontinuous and thereby the time of exfoliation of the film is delayed and a cleaning cycle of the attachment-repellent plate is lengthened and therefore the decline in an yield due to the exfoliation of the film is prevented.
SUEOKA MANABU
KAWAJIRI YUKIO
YAMAMOTO HISASHI
SUZUKI TAKUMI
SUZUKI TOSHIO
SHIBATA MAKOTO
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