Title:
MANUFACTURE OF THROUGH-HOLE PRINTED-CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPH01124285
Kind Code:
A
Abstract:
PURPOSE:To surely and efficiently remove a resist-coated layer in the case of a fine pattern with a narrow pattern space by a method wherein the resist- coated layer of an inverted pattern is removed while the surface of a board is rubbed by using a mechanically actuated brush in a state that the resist- coated layer is swollen. CONSTITUTION:A pattern of a target wiring part and a resist-coated layer 6 of an inverted pattern are formed on copper-plated layers 5 situated on both main faces of a substrate 1 by using an alkalineremoval dry film; then, an etching resist 7 composed of an electro-deposited coated layer is formed by using an alkyd resin-based anion electrodeposition paint. After that, the substrate 1 is immersed in a 2% aqueous solution of sodium hydroxide at 40 deg.C for two minutes; the resist-coated layer 6 is swollen; while water is sprayed from nozzles 9, the surface of the substrate 1 is rubbed by using turning roll-shaped brushes 8; the resist-coated layer 6 is removed; an exposed plated layer 5 and a copper layer 3 under it are etched and removed; in addition, said etching resist 7 is stripped off and removed; a printed-circuit board is formed.
Inventors:
YASUNO HIROSHI
SAKATANI SHIRO
KANDA TAKESHI
SAKATANI SHIRO
KANDA TAKESHI
Application Number:
JP28264487A
Publication Date:
May 17, 1989
Filing Date:
November 09, 1987
Export Citation:
Assignee:
UBE INDUSTRIES
MEIKO ELECTRONICS CO LTD
MEIKO ELECTRONICS CO LTD
International Classes:
H05K3/06; (IPC1-7): H05K3/06
Attorney, Agent or Firm:
Osamu Hatori
Previous Patent: MANUFACTURE OF PRINTED-CIRCUIT BOARD
Next Patent: MANUFACTURE OF PRINTED-CIRCUIT BOARD
Next Patent: MANUFACTURE OF PRINTED-CIRCUIT BOARD