To provide the manufacturing method of the wiring board having a transparent conducting layer, the manufacturing process and reduces the manufacturing cost to low.

The wiring board is manufactured by the following processes: the process, which prints metal paste 4', whose filler containing rate is 50-80 weight %, is printed in the negative pattern on the upper surface of a glass board 1; the process of applying transparent conducting paste 2' almost entirely over the surface of the upper surface of the glass board on which the metal paste 4' is printed; the process of baking the metal paste 4' and the transparent conducting paste 2' at the same time and converting the paste into a metal oxide layer 4 and a transparent conducting layer 2; and the process of forming the transparent layer 2 of the specified pattern on the upper surface of the glass board 1 by removing the metal oxide layer 4 and the transparent conducting layer 2 formed on the upper surface of the metal oxide layer 4 from the upper part of the glass board 1.