Title:
MANUFACTURE OF WIRING BOARD
Document Type and Number:
Japanese Patent JP05146906
Kind Code:
A
Abstract:
PURPOSE: To abolish the constituting work of stiffening plate on a wiring board and reduce the material cost of the stiffening plate.
CONSTITUTION: A stiffening plate material 2 is machined into a ribbon shape having the width of 5-10mm, it is mounted on the head 1 of a driller, it is connected to the drilling data, a fixed quantity of the ribbon is automatically fed when one hole is bored, and a winding function is provided for hole machining.
Inventors:
Sugiyama, Takashi
Application Number:
JP1991000310679
Publication Date:
June 15, 1993
Filing Date:
November 26, 1991
Export Citation:
Assignee:
HITACHI CHEM CO LTD
International Classes:
B23B41/00; B23B49/02; H05K3/00; B23B41/00; B23B49/00; H05K3/00; (IPC1-7): B23B41/00; B23B49/02; H05K3/00
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