Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MANUFACTURE OF WOOD POWDER MOLDED PLATE
Document Type and Number:
Japanese Patent JPS62146603
Kind Code:
A
Abstract:

PURPOSE: To enable the wood powder molded plate with excellent surface condition and yet less warpage to be produced by casting hydrous substance into the part being contact with the surface of a mold.

CONSTITUTION: The chip 3 for surface layer composed of adhesive coating wood chip containing a hydrous substance is coat into the surface of a female mold 1. Next, the chip 4 for the intermediate composed of only the adhesive coating wood chip is cast thereon, and the molding under compressing and heating is carried out, thereby obtaining a wood powder-molded pate. As a hydrous substance, the inorganic substance such as a magnesia cement powder, etc., or the resin with high water absorption property such as starch acryl resin copolymer or hydrophilic polymer of acryl family is effectively used. If the wood chip is top small, much adhesive is necessary, and if the wood chip is too large, the surface condition of the wood powder-molded plate or the property of its cross-section becomes inferior. Therefore, the chip preferably has such size that it can not pass the screen of 50 meshes, but it can pass the screen of 2mm. As a hydrous adhesive, generally urea resin, etc. are used for coating at 5W20% weight ratio to the wood chip.


Inventors:
TERAYAMA KENICHI
Application Number:
JP28687185A
Publication Date:
June 30, 1987
Filing Date:
December 21, 1985
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
EIDAI CO LTD
International Classes:
B27N3/02; B27N3/18; (IPC1-7): B27N3/02; B27N3/18
Domestic Patent References:
JPS598552A1984-01-17
Attorney, Agent or Firm:
Yusuke Hiraki