PURPOSE: To provide an electronic component manufacturing apparatus with an improved operation efficiency by promptly changing the type of electronic component intermediate having a lead frame.
CONSTITUTION: This invention relates to a lead working machine made up of components corresponding to a plurality of types of electronic component intermediates 1, such as a plurality of loaders 11, a metal mold 12, and a conveyor rail 13, as well as a solder dip machine 20 made up of units in a row, such as a posture changing unit 21, a flux processing unit 22, a solder plating unit 23, a cleaning unit 24, a drying unit 26, and a component discharging out unit 27 and used for plating the types of electronic component intermediates 1 by soldering. Moreover, a control board 14 is provided for push buttons used in operation for selecting the type of electronic component intermediate 1 to be worked by the lead working machine 10 or changing a solder process condition that is different according to the type of electronic assemblies 1.
UCHIYAMA NORIHIRO
IKEDA HIROYUKI
