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Title:
MANUFACTURING DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR SINGLE CRYSTAL
Document Type and Number:
Japanese Patent JP2007284323
Kind Code:
A
Abstract:

To provide a manufacturing device and a manufacturing method for a semiconductor single crystal by which a silicon single crystal having a desired defect region or a desired defect-free region can be easily manufactured in high yield.

The manufacturing device for a semiconductor single crystal to control a grown-in defect in a semiconductor single crystal is equipped with: a reset heating means 12 that heats and maintains the single crystal at a thermal hysteresis reset temperature to reset the thermal hysteresis during manufacturing the single crystal which influences the grown-in defect state in the single crystal; and a thermal hysteresis re-imparting means that re-imparts a thermal hysteresis which decreases the temperature of the single crystal from the thermal hysteresis reset temperature and generates a desired state of the grown-in defect state.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
NISHIMOTO MANABU
ONO NAOKI
Application Number:
JP2006116928A
Publication Date:
November 01, 2007
Filing Date:
April 20, 2006
Export Citation:
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Assignee:
SUMCO CORP
International Classes:
C30B33/02
Domestic Patent References:
JPH11349394A1999-12-21
JP2005142434A2005-06-02
JP2007284324A2007-11-01
JPH0741389A1995-02-10
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Masakazu Aoyama
Yasuhiko Murayama