Title:
MANUFACTURING DEVICE AND METHOD OF SEMICONDUCTOR SUBSTRATE
Document Type and Number:
Japanese Patent JP2943673
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To simplify a semiconductor substrate manufacturing processes than in the conventional process and reduce the number of process steps by a method wherein an operation carried out for checking semiconductor substrates on crystalline orientation piece by piece through a method such as an X-ray diffraction method or the like is dispensed with.
SOLUTION: The blade 5 of a semiconductor crystal 2 is loaded and held on the jig of a cutter as aligned, wherein the blade 5 is mounted on the semiconductor crystal 2 conforming to the specific crystalline orientation of the crystal 2. A laser marking device makes marks through such a manner that laser rays emitted from a laser oscillation device 10 are concentrated on specific spots on the round surface of the semiconductor crystal 2 by an optical lens 12 through the intermediary of a shutter 11. The marked semiconductor crystal 2 is cut into wafer-like semiconductor substrates by a cutter. Markings are conducted on the residual semiconductor crystal 2 at the same spots again, then the residual semiconductor crystal 2 is cut into water-like semiconductor substrates, and the above process is repeatedly carried out.
Inventors:
MURAMATSU SATOSHI
Application Number:
JP28287395A
Publication Date:
August 30, 1999
Filing Date:
October 31, 1995
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
B28D5/02; B28D5/00; B44B7/00; H01L21/02; H01L21/304; (IPC1-7): H01L21/304; B28D5/02; H01L21/02
Domestic Patent References:
| JPS6241145B2 | ||||
| JPH0653100A |
Attorney, Agent or Firm:
Matsuura