To provide a manufacturing device and a manufacturing method for manufacturing a reliable tape-shaped package in which a trouble hardly occurs when taking out a stored electronic component.

In the manufacturing device and a manufacturing method for manufacturing a tape-shaped package in which recesses for storing components at a predetermined interval along the longitudinal direction of the resin tape on one side of the resin tape, the recesses are successively formed through the half-cut treatment. The recesses of the manufactured tape-shaped component package are hardly return-deformed under the environment at normal temperature to effectively prevent in advance any occurrence of a condition that the electronic components stored in the recesses are hardly taken out.