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Title:
MANUFACTURING DEVICE FOR OPTICAL RECORDING MEDIUM AND MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP3777737
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To unneccesitate transportation mechanism of a mold, to shorten a transportation time of a mold, and to miniaturize a mold by transporting a substrate coated with hardened type resin to a mold of a mold holding mechanism, placing an application plane so as to oppose to a mold, hardening hardened type resin held between the mold and the substrate, and peeling off hardened resin from the mold with the substrate.
SOLUTION: A transportation mechanism 1 is attached to an arm 11 freely rotatably held on a holding mount 10 by a shaft and a peeling off mechanism 4 is attached to an arm 41 freely rotatably held on a holding mount 40 by a shaft. The device is constituted so that the transportation mechanism 1 and the peeling off mechanism 4 are alternately driven and a hardening mechanism 3 can be transferred to a position at which operations of these arms 11, 41 are not prevented during operation of any of other mechanisms. Also, a mold 103 is fixed in a seal up container 20 of a mold holding mechanism 2, the transportation mechanism 1 and the peeling off mechanism 4 placed at an opposing position each other can carry in and carry out the substrate by the arms 11, 41. Releasing and operation of a fixing mechanism of the mold 103 are not required to be repeated.


Inventors:
Takafumi Atsushi
Nao Nishikawa
Satoshi Nebashi
Application Number:
JP22828297A
Publication Date:
May 24, 2006
Filing Date:
August 25, 1997
Export Citation:
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Assignee:
Seiko Epson Corporation
International Classes:
B29D17/00; B29C35/08; B29C39/10; B29C39/26; B29C39/36; B29C43/02; G11B7/26; B29K101/10; B29L17/00; (IPC1-7): G11B7/26; G11B7/26; B29D11/00; //B29K101:10
Domestic Patent References:
JP3225640A
JP3173985A
JP58173626A
JP57087332A
Attorney, Agent or Firm:
Masahiko Ueyanagi
Osamu Suzawa