Title:
MANUFACTURING DEVICE FOR SEMICONDUCTOR INTEGRATED CIRCUIT
Document Type and Number:
Japanese Patent JP06232087
Kind Code:
A
Abstract:
PURPOSE: To provide a semiconductor integrated circuit manufacturing device where a means for accurately measuring the temperature on the surface of a wafer without loading a probe into a chamber where etching is performed is provided.
CONSTITUTION: The device for performing treatment in a system which is shielded from atmosphere is provided with means 1 and 2 for measuring the amount of expansion and contraction due to thermal expansion or contraction of an object 10 to be treated and a means 20 for calculating temperature according to the amount of expansion and contraction which is measured by the means for measuring amount of expansion and contraction and the coefficient of expansion of the object to be treated.
Inventors:
Oketa, Yukihiro
Application Number:
JP1993000020068
Publication Date:
August 19, 1994
Filing Date:
February 08, 1993
Export Citation:
Assignee:
NIPPON STEEL CORP
International Classes:
C23F4/00; G01B11/02; G01K1/14; G01K5/48; H01L21/302; H01L21/3065; H01L21/66; C23F4/00; G01B11/02; G01K1/14; G01K5/00; H01L21/02; H01L21/66; (IPC1-7): H01L21/302; C23F4/00; G01B11/02; G01K1/14; G01K5/48; H01L21/66
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