To suppress the occurrence of chipping etc., at a parting surface due to a dropping when an aggregate of a plurality of electrooptical devices is parted into the individual electrooptical devices by a scribe break method.

The aggregate 20 on a receiving tool 306 is parted by applying pressure with a break bar 30 from above an elastic sheet 308, and a plate-shaped member 310 is put over the elastic sheet 308 to sandwich the aggregate 20 between the receiving tool 306 and plate-shaped member 310. The aggregate is mounted with the plate-shaped member 308 down, the receiving jig 306 is removed, and the elastic sheet 308 is expanded and contracted to part the aggregate 20 into the individual electrooptical devices. Thus, the aggregate can completely be parted including a layer of an adhesive 210 by expanding and contracting the elastic sheet 308, so the aggregate 20 of the electrooptical devices including a plurality of substrates joined with a ductile substance, i.e. the adhesive can be parted while damage due to a dropping etc., are suppressed.

COPYRIGHT: (C)2007,JPO&INPIT