回路基板積層用キャリア付きFe-Ni合金箔の製造方法、回路基板積層用キャリア付き複合箔の製造方法、キャリア付き合金箔、キャリア付き複合箔、金属張板、プリント配線板及びプリント配線積層板

Title:

Document Type and Number:

Japanese Patent JP4805300

Kind Code:

B2

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Inventors:

Akira Kawakami
Suzuki Akitoshi
Takuyuki Ikeda
Yosuke Hioki

Application Number:

JP2008090556A

Publication Date:

November 02, 2011

Filing Date:

March 31, 2008

Export Citation:

Assignee:

THE FURUKAW ELECTRIC CO.,LTD.

International Classes:

H05K1/09; B32B15/08; C25D5/10; C25D7/06

Domestic Patent References:

Attorney, Agent or Firm:

Takahisa Sato

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