Title:
SOI基板の製造方法
Document Type and Number:
Japanese Patent JP5154243
Kind Code:
B2
Inventors:
Takashi Itoka
High Yu Fuji
High Yu Fuji
Application Number:
JP2008015590A
Publication Date:
February 27, 2013
Filing Date:
January 25, 2008
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01L21/02; H01L21/336; H01L21/762; H01L27/12; H01L29/786
Domestic Patent References:
| JP2002217417A | ||||
| JP11163363A | ||||
| JP6289421A | ||||
| JP2002076336A | ||||
| JP5281573A |
Attorney, Agent or Firm:
Kenzo Hara International Patent Office