回路部材接続用接着剤シート及び半導体装置の製造方法

Title:

回路部材接続用接着剤シート及び半導体装置の製造方法

Document Type and Number:

Japanese Patent JP5477144

Kind Code:

B2

Abstract:

Disclosed is an adhesive sheet for connecting a circuit member, which comprises a supporting base and an adhesive layer that is provided on the supporting base and composed of an adhesive composition. The adhesive composition contains (A) a high molecular weight component having a weight average molecular weight of not less than 100,000, (B) an epoxy resin, (C) a phenolic epoxy resin curing agent, (D) a radiation polymerizable compound, (E) a photoinitiator and (F) a curing accelerator.

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Inventors:

Keisuke Okubo
Akira Nagai

Application Number:

JP2010100219A

Publication Date:

April 23, 2014

Filing Date:

April 23, 2010

Export Citation:

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Assignee:

Hitachi Chemical Co., Ltd.

International Classes:

H01L21/56; C09J4/00; C09J7/22; C09J7/30; C09J11/00; C09J133/00; C09J161/12; C09J163/00; C09J201/00; H01L21/60; H01L23/29; H01L23/31

Domestic Patent References:

JP2005235530A
JP2008103700A
JP2000252321A
JP2007016074A
JP2006049482A

Attorney, Agent or Firm:

Yoshiki Hasegawa
Yoshinori Shimizu

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