To provide a method and apparatus for manufacturing a printed circuit board with high reliability in preventive measure against unnecessary short-circuiting at an interlayer connected position and realizing high-speed via-hole processing.
The manufacturing apparatus includes a feed unit 101 for feeding a substrate, a substrate transportation unit 105 for transporting the substrate, a length measuring unit 102 for measuring the position of a reference mark for via-hole process, a measurement control unit 107 for processing the measured data, a separation via-hole processing unit 103 for carrying out via hole processing for each division of the substrate on the basis of the measured data, a laser casting unit 106 for casting a laser beam for via hole process, and a substrate take-out unit 104. The position of reference mark is recognized by X-ray or by an optical method, and the via hole processing is carried out at the separation via hole processing unit 103 on the basis of the position measured data, so high-speed high-accuracy separation via hole processing is realized.
HIRATA SHINJI
OCHI AKIO
