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Title:
MANUFACTURING METHOD OF BACKING WITH LEAD AND BACKING WITH LEAD
Document Type and Number:
Japanese Patent JP2018027235
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To reduce an accumulation error of a lead interval in a lamination direction accompanied by the lamination processing of a lead frame including lead rows which are aligned in one direction, in a lead array possessed by a backing with leads.SOLUTION: A backing material 22a blended with a plurality of spacer particles 50 is coated on an upper side face of a lead frame 46 including a plurality of leads 24 which are set (accumulated) on a jig 40, and aligned in one direction. A succeeding lead frame 46 is laminated on an upper side of the lead frame 46 which is coated with the backing material 22a blended with a plurality of the spacer particles 50. Therefore, a plurality of the spacer particles 50 are sandwiched between the two lead frames 46. By this constitution, an interval between the two lead frames 46, that is, a lead interval in one direction of the lead array which is two-dimensionally aligned is decided by diameters of a plurality of the spacer particles 50.SELECTED DRAWING: Figure 3

Inventors:
KATSURA HIDETSUGU
TAWARA YOSHIHIRO
IWASHITA TAKAYUKI
SHIRAISHI TOMOHIRO
Application Number:
JP2016160758A
Publication Date:
February 22, 2018
Filing Date:
August 18, 2016
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
A61B8/14; H04R17/00; H04R31/00
Attorney, Agent or Firm:
Patent Corporation yki International Patent Office



 
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