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Title:
半導体用硼素ドープ材の製造方法
Document Type and Number:
Japanese Patent JP4394814
Kind Code:
B2
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Inventors:
Takashi Castle
Yutaka Hirashima
Kawasaki Taku
Application Number:
JP2000279313A
Publication Date:
January 06, 2010
Filing Date:
September 14, 2000
Export Citation:
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Assignee:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
International Classes:
C04B35/583; H01L21/223
Domestic Patent References:
JP10303137A



 
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