MANUFACTURING METHOD OF CAPACITIVE TRANSDUCER, AND CAPACITIVE TRANSDUCER

Japanese Patent JP2015213224

A

PROBLEM TO BE SOLVED: To provide a technology for suppressing damage on a through electrode even in a manufacturing method employing sacrificial layer etching in a capacitive transducer to be manufactured on a through electrode substrate.SOLUTION: The manufacturing method of the capacitive transducer including a cell 20 including a vibration film 10 including a second electrode 8 that is provided relatively to a first electrode 4 with a gap 6 interposed therebetween, on a substrate 1 including a through electrode 3 includes: forming the first electrode on the substrate including the through electrode; forming an electrode protection layer 5 for protecting the through electrode and the first electrode; forming a sacrificial layer 6a made of a material of which the etching speed is different from that of the through electrode, on the electrode protection layer; and forming a layer that constitutes a part of the vibration film on the sacrificial layer. Further, an etching hole 11 is formed in the layer that constitutes a part of the vibration film, and the sacrificial layer is etched by using an etchant of which the etching speed to the sacrificial layer is higher than the etching speed to the through hole, such that a sealing layer 12 is formed which seals the etching hole.

JP4104550	Ultrasonic Printed Circuit Board Transducer
JP4472613	Microphone device
JP5374077	MEMS sensor

TOMIYOSHI TOSHIO

JP2014094922A

November 26, 2015

May 02, 2014

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CANON KK

H04R31/00; A61B8/00; B81B3/00; B81C1/00; H04R19/00

Kazuo Kato

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