To provide a manufacturing method of a carrier for printed board manufacturing which simplifies the carrier structure, couples joining means not only to a side surface of a metal layer but also to an upper surface to improve the connection reliability of an outer peripheral part of the carrier, and to provide a manufacturing method of the printed substrate.
A manufacturing method of a carrier for printed board manufacturing includes: a step (A) where a first carrier 100a is prepared by forming a first opening 105 in first joining means 102 and positioning a first metal layer 101 in the first opening 105; a step (B) where a second carrier 100b is prepared by forming a second opening 106 in second joining means 104 and positioning a second metal layer 103 in the second opening 106; and a step (C) where the first carrier 100a is coupled to the second carrier 100b so that the first metal layer 101 is coupled to the second joining means 104, the second metal layer 103 is coupled to the first joining means 102, and the first metal layer 101 and the second metal layer 103 are partially overlapped in an extension surface of a surface where the first metal layer 101 is coupled to the second metal layer 103.
AN JIN YONG
CHO SUK HYEON
KIM KI HWAN
LEE SEOK KYU
| JP2009088429A | 2009-04-23 | |||
| JP2005353659A | 2005-12-22 | |||
| JPS58112393A | 1983-07-04 | |||
| JPS60157288A | 1985-08-17 | |||
| JPH04162493A | 1992-06-05 |
Koji Kikawa
Hiroyuki Sato
Shigeru Koike