Title:
セラミック電子部品の製造方法
Document Type and Number:
Japanese Patent JP7230867
Kind Code:
B2
Abstract:
To provide a ceramic electronic component in which an external electrode has good solder wettability despite a Ni plating layer includes a stress relaxation agent.SOLUTION: In a manufacturing method of a ceramic electronic, a step of forming an external electrode of a ceramic electronic component 100 includes a step of forming a base electrode layer 6 on a ceramic body 1, a step of forming a Ni plating layer 7 on the base electrode layer 6, a step of cleaning the ceramic body, and a step of forming an Sn plating layer 10 on the Ni plating layer 7. A stress relaxation agent is added to an Ni plating bath. In the cleaning step, the ceramic body 1 is immersed in a washing tank twice or more. When the movement is performed from the Ni plating bath or Sn plating bath to the washing tank, a time that the ceramic element 1 is exposed to the atmosphere is controlled to 60 seconds or less.SELECTED DRAWING: Figure 1
Inventors:
Kenichi Hayashi
Sarubami Masato
Sarubami Masato
Application Number:
JP2020035398A
Publication Date:
March 01, 2023
Filing Date:
March 02, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01G4/30
Domestic Patent References:
| JP6246435A | ||||
| JP2002004098A | ||||
| JP2013104119A |
Foreign References:
| WO2013111625A1 |
Attorney, Agent or Firm:
Takashi Kawamoto