To reduce plating defects while enhancing productivity of a plating process in forming an external electrode of a chip-like electronic component such as a laminated ceramic capacitor.
A magnetism varying part 4 is arranged on the lower side of a bottom surface 2 of a plating bath 1 provided with the bottom surface 2 without having residual magnetism, and a side surface 3 having a negative electrode 7; chip-like electronic components 15 each containing a magnetic substance such as nickel are arranged on the bottom surface 2 of the plating bath 1 without being filled with a plating liquid 18; magnetism is generated in the magnetism varying part 4; thereafter the magnetism is eliminated from the magnetism varying part 4 after filling the plating liquid 18; and an electrolytic plating process is executed by arranging the chip-like electronic components 15 on the side surface 3 of the plating bath 1 by rotating the plating bath 1.
Hiroki Naito
Daisuke Nagano