Title:
チップ状電子部品の製造方法
Document Type and Number:
Japanese Patent JP5278500
Kind Code:
B2
Abstract:
To provide a method for manufacturing a chip-shaped electronic component which can easily manufacture a chip-shaped electronic component with a high manufacturing yield.
An adhesion process is performed which sticks either of surfaces of an electronic component body 30 to a base 20 having an adhesive surface 20a. A slider 23 is slid relatively to the base 20 with the slider 23 abutted to a side opposed to the base 20 of the electronic component body 30, so that the electronic component body 30 is rotated, and the surface other than one surface of the electronic component body 30 is sticked to the base 20 to form a functional component.
COPYRIGHT: (C)2011,JPO&INPIT
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Inventors:
Minoru Dooka
Kunimoto Kazunori
Katsunori Ogata
Naohiro Yamada
Kunimoto Kazunori
Katsunori Ogata
Naohiro Yamada
Application Number:
JP2011125600A
Publication Date:
September 04, 2013
Filing Date:
June 03, 2011
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01G13/00; H01C17/28; H01F27/29; H01G4/12; H01G4/252; H01G4/30
Domestic Patent References:
| JP2007266208A | ||||
| JP2008251824A | ||||
| JP2003007574A | ||||
| JP6260377A | ||||
| JP10224129A |
Attorney, Agent or Firm:
Patent business corporation Miya saki, table of contents patent office