Title:
MANUFACTURING METHOD FOR CHIP-TYPE ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2023147927
Kind Code:
A
Abstract:
To provide a manufacturing method for a chip-type electronic component that allows a spacer to be formed in a desired position with high precision.SOLUTION: A manufacturing method for a chip-type electronic component in which a spacer is provided on the surface of an external electrode of an electronic component body having a plurality of external electrodes protruding outward with respect to a main body includes a step (S1) of preparing the electronic component body, a step (S2) of holding the electronic component body such that the plurality of external electrodes are exposed on the same side of the main body, a step (S3) of supplying metal paste into a plurality of recesses of an intaglio plate having the plurality of recesses, and a step (S4) of transferring the metal paste to the plurality of external electrodes by bringing the held electronic component body close to the intaglio plate and bringing each of the plurality of external electrodes exposed on the same side of the main body into contact with the metal paste in the plurality of recesses of the intaglio plate.SELECTED DRAWING: Figure 4
Inventors:
TANAKA HIROSHI
SASADA MANABU
SASADA MANABU
Application Number:
JP2022055714A
Publication Date:
October 13, 2023
Filing Date:
March 30, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H01G13/00; H01G2/02; H01G2/06; H01G4/228; H01G13/04
Attorney, Agent or Firm:
Patent Attorney Fukami Patent Office
Takahiro Nosue
Hitoshi Nishizawa
Takahiro Nosue
Hitoshi Nishizawa