Title:
回路保護素子の製造方法
Document Type and Number:
Japanese Patent JP4306892
Kind Code:
B2
Inventors:
Etsuji Yamaoka
Application Number:
JP25127099A
Publication Date:
August 05, 2009
Filing Date:
September 06, 1999
Export Citation:
Assignee:
KOA Corporation
International Classes:
H01H85/00; H01H85/06; H01H69/02; H01H85/02; H01H85/044; H01H85/045; H01H85/10; H01H85/17; H01H85/34
Domestic Patent References:
| JP9063454A | ||||
| JP7085771A |
Attorney, Agent or Firm:
Shintaro Hotta
Isamu Watanabe
Ryoji Kosugi
Isamu Watanabe
Ryoji Kosugi