Title:
MANUFACTURING METHOD OF COIL SUBSTRATE AND MANUFACTURING METHOD OF THE COIL SUBSTRATE FOR MOTOR
Document Type and Number:
Japanese Patent JP2022033422
Kind Code:
A
Abstract:
To provide a manufacturing method of a coil substrate having a high connection reliability.SOLUTION: In a manufacturing method of a coil substrate of an embodiment, a flexible substrate 22z formed by a flexible material 22, a first conductive layer 31, and a second conductive layer 32 is prepared. An open 31a is formed in a first conductive layer 31. By removing the flexible material 22 exposed by the open 31a, a penetration hole 22a is formed in the flexible material 22. By forming a conductive layer 34, a third conductive layer 33 formed by the first conductive layer 31 and the conductive layer 34 is formed. A via conductor VA is formed in the penetration hole 22a. A first circuit 51 is formed by the third conductive layer 33, and a second circuit 52 is formed by the second conductive layer 32.SELECTED DRAWING: Figure 3
Inventors:
MORITA HARUHIKO
MIWA HITOSHI
KATO SHINOBU
YOKOMAKU TOSHIHIKO
KATO HISASHI
HIRASAWA TAKAHISA
MURAKI TETSUYA
FURUNO TAKAYUKI
MIWA HITOSHI
KATO SHINOBU
YOKOMAKU TOSHIHIKO
KATO HISASHI
HIRASAWA TAKAHISA
MURAKI TETSUYA
FURUNO TAKAYUKI
Application Number:
JP2020137297A
Publication Date:
March 02, 2022
Filing Date:
August 17, 2020
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H01F41/04; H02K3/26; H05K1/16; H05K3/40
Domestic Patent References:
| JPH05276699A | 1993-10-22 | |||
| JP2019140762A | 2019-08-22 | |||
| JP2007035716A | 2007-02-08 | |||
| JP2012186377A | 2012-09-27 | |||
| JP2012079768A | 2012-04-19 |
Attorney, Agent or Firm:
Akito Tagashita