Title:
コイル装置の製造方法
Document Type and Number:
Japanese Patent JP7022298
Kind Code:
B2
Abstract:
To prevent the outflow of a resin to the outside of a tape during heat treatment, from a resin-impregnated insulation tape that is wound in a region between a coil wound around a reel of a coil device and an end of the reel.SOLUTION: A coil device includes: a coil 11 which includes a cylindrical bobbin 10 having a coil winding area 10A and a flange 10B and which is wound in the coil winding area 10A; and a combination tape 12, as an insulation tape for the coil device, wound at a position in contact with the flange 10B, the position being on an end side of the coil winding area 10A. The combination tape 12 is formed by laminating an epoxy resin-impregnated tape as a resin impregnated tape and a Tetron woven tape as a resin absorbing tape.SELECTED DRAWING: Figure 1
Inventors:
Tatsuaki Okano
Eiji Koide
Masateru Hashimoto
Eiji Koide
Masateru Hashimoto
Application Number:
JP2017116029A
Publication Date:
February 18, 2022
Filing Date:
June 13, 2017
Export Citation:
Assignee:
Sumida Corporation
International Classes:
H01F41/12; H01B17/56; H01B17/60
Domestic Patent References:
| JP63207011A | ||||
| JP2009038244A | ||||
| JP62078807A | ||||
| JP52049458A | ||||
| JP56159011A | ||||
| JP64004009A | ||||
| JP200580468A |
Attorney, Agent or Firm:
Hiroshi Kawano
Teruhisa Tsukui
Teruhisa Tsukui