To provide a manufacturing method of a coil molding that can improve heat conductivity and heat dissipation of the coil molding formed of a coil and a resin in one body, and to provide the coil molding itself.
Disclosed is the manufacturing method of the coil molding formed of the coil and resin in one body by injecting the resin into a mold 20 wherein the coil 11 is disposed, the coil molding being manufactured by disposing the rectangular wire edgewise winding coil 11 in the mold 20, pressing and holding the coil with a coil pressing means 30 in a state wherein adjacent rectangular wire plane portions 11a are in contact with each other along the coil axis, then injecting the resin into the mold 20, retracting the coil pressing means 30 from the coil 11 once in such a way that the compressed state of the coil 11 is maintained as it is by the injection of the resin, and then making the rectangular wire adjacent plane portions 11a wound around the coil come into contact with each other so that no resin enter between the plane portions 11a.
JPS6447010 | MANUFACTURE OF CHIP INDUCTOR |
WO/2013/031880 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME |
JPS55134919A | 1980-10-21 | |||
JP2004193215A | 2004-07-08 | |||
JP2002373814A | 2002-12-26 |
Rikio Murota