Title:
組成物、密着膜、積層体、硬化物パターンの製造方法および回路基板の製造方法
Document Type and Number:
Japanese Patent JP6815488
Kind Code:
B2
Abstract:
There are provided a composition having excellent adhesiveness and wettability, an adhesive film, a laminate, a method for producing a cured product pattern, and a method for manufacturing a circuit substrate. A composition for forming an adhesive film for imprinting, includes a compound 1 or a compound group 2; and a solvent, in which the compound 1 and the like is a compound decomposable into two or more compounds in a case where a polarity conversion group is treated, and at least one compound has a molecular weight of 30 to 400, and at least one compound has a molecular weight of 1,000 or more, the compound 1: a compound is a resin having a polymerizable group and a polarity conversion group, in which the resin has the polarity conversion group in at least a main chain or a side chain, the polarity conversion group is bonded to the main chain of the resin via a linking group in a case where the polarity conversion group is provided in the side chain, and the number of atoms constituting a chain of the linking group is 8 or more; and the compound group 2: a compound that has a polymerizable group and does not have a polarity conversion group, and a compound that does not have a polymerizable group and has a polarity conversion group.
Inventors:
Naoya Shimoshige
Akinori Shibuya
Yuichiro Goto
Akinori Shibuya
Yuichiro Goto
Application Number:
JP2019512526A
Publication Date:
January 20, 2021
Filing Date:
April 10, 2018
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
H01L21/027; B29C59/02; C08F8/00; C08F299/00
Domestic Patent References:
| JP2016146468A | ||||
| JP2014192178A | ||||
| JP2014024322A | ||||
| JP2012086484A |
Foreign References:
| WO2016148095A1 |
Attorney, Agent or Firm:
Patent Service Corporation Patent Office Sykes